Thermal Optimizations for OSFP Optical Transceiver Modules

ABSTRACT

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 17/122,658 filed on Dec. 15, 2020, which claims the benefit ofthe filing date of U.S. Provisional Patent Application No. 63/047,410filed on Jul. 2, 2020, the disclosures of which are hereby incorporatedherein by reference.

BACKGROUND

Octal Small Formfactor Pluggable (OSFP) is a module and interconnectsystem with a pluggable form factor with eight high speed electricallanes. OSFP was designed to initially support 400 Gbps (8 lanes×50G perlane) optical data links. Compared to other form factors, such as QSFP,OSFP is slightly wider and deeper but still supports 36 ports per 1Ufront panel, which enables a theoretical 400G bitrate through an OSFPmodule. The OSFP has several advantages, including that it is reversecompatible with QSFP formats through simple adapters. The OSFP continuesto become more common in supporting optics technologies for datacenterand other data transfer applications.

Current OSFP modules consume roughly 10-15 watts to achieve a 400Gbitrate. However, as the throughput requirements on the OSFP moduleincrease, the wattage requirements also increase. This in turn increasesthe thermal load and electromagnetic interference on the OSFP. With thecurrent standard OSFP form factor, these effects lead to issues inoperating the OSFP modules at higher bit rates or throughputs due tothermal and electrical effects.

Further, as the OSFP Module specifications define specific mechanicalform factors and electric parameters for compliance with the standard,the above problems cannot be addressed by changing the mechanical formfactors of the modules. There is a need for solutions to enable OSFPmodules to operate at higher bitrates while maintaining compliance withthe OSFP module specification.

SUMMARY

The present disclosure provides methods, systems, and apparatuses forthermal and electrical optimizations for OSFP optical transceivermodules.

One aspect of the present disclosure provides an assembly, the assemblycomprising an octal small form factor pluggable (OSFP) module includinga data connector, a first heatsink having a top surface and an opposedbottom surface facing toward the OSFP module, a first plurality ofhollow channels formed between the OSFP module and the bottom surface, asecond heatsink having a surface overlying the top surface of the firstheatsink and thermally connected with the top surface, and a pluralityof fins extending away from the surface of the second heatsink.

Additional aspects of this disclosure provides an assembly, the assemblycomprising an octal small form factor pluggable (OSFP) module includinga data connector, a first heatsink having a top surface and an opposedbottom surface facing toward the OSFP module, a first plurality ofhollow channels formed between the OSFP module and the bottom surface, asecond heatsink having a surface overlying the top surface of the firstheatsink and thermally connected with the top surface, and a pluralityof fins extending away from the surface of the second heatsink. A firstspace can exist between at least a first pair of two adjacent fins ofthe plurality of fins differs from a second pair of adjacent fins, so asto optimize a thermal performance characteristic of the module. Thesecond heatsink can the top surface. A housing can be configured forreceiving the OSFP module therein and positioned between the secondheatsink and the surface. The housing can include an opening throughwhich the OSFP module and the second heatsink are thermallyinterconnected. At least part of the module can be comprised of adiamond composite material. In some examples, the diamond compositematerial can be a silver diamond material. The diamond compositematerial can be aluminum diamond. At least part of the module can bemade of a metal composite material.

Additional aspects of this disclosure provides a system, the systemcomprising an outer housing having an opening; an assembly disposedwithin the outer housing, wherein the second plurality of fins areconfigured to receive airflow from the opening. The assembly cancomprise an octal small form factor pluggable (OSFP) module including adata connector, a first heatsink having a top surface and an opposedbottom surface facing toward the OSFP module, a first plurality ofhollow channels formed between the OSFP module and the bottom surface, asecond heatsink having a surface overlying the top surface of the firstheatsink and thermally connected with the top surface, and a secondplurality of fins extending away from the surface of the secondheatsink.

Additional aspects of this disclosure provides a system, the systemcomprising an Octal Small Formfactor Pluggable (OSFP) compatible module,an air duct with a first end and a second end, the first end of the airduct forming a closed connection with a back side of the module, ablower, with a first end and an exhaust, the first end of the blowerforming a closed connection with the second end of the air duct; and anairpath formed from the front side of the module to the exhaust end ofthe blower through at least the air duct. The module can comprise afront side and a back side opposite the front side; a substantiallycontinuous top surface extending from a portion of the front side to aportion of the back side and a data connector formed on the front side.The air duct can be formed from a metal composite material. The relativedimensions of the air duct can be based on the air-pressure or air-speedat the back side of the module. The geometry of the air duct can bearranged to prevent the formation of vortices within the system. Thefrequency of the blower can be based on the geometry of the module. Thefrequency of the blower can be based on the air-pressure or air-speed atthe back side of the module. The airpath can be optimized for heatdissipation from the module.

Additional aspects of this disclosure provides an assembly, the assemblycomprising an Octal Small Formfactor Pluggable (OSFP) compatible module,comprising a front side and a back side opposite the front side; asubstantially continuous top surface extending from a portion of thefront side to a portion of the back side; a data connector disposedformed on the front side, a plurality of pin-fins formed in an arrayacross the top surface, each pin-fins substantially non-linear in shapeand enclosing an area formed by a closed loop on the top surface,wherein the plurality of pin-fins minimize a pressure gradient betweenthe front side and the back side of the module. Each pin-fin can beformed in a diamond shape. The front side can contain substantially openair channels above the data connector. The plurality of pin-fins canform rows offset from one another. The plurality of pin-fins can coverat least 30% of the surface area of the top surface. Each pin-fin canform an air-foil, the air-foil providing a path for fluid to move acrossthe top surface. The air-foil can be configured to align with aspring-loaded chamfer formed in a housing for the module. The pluralityof pin-fins can be configured to attenuate electro-magneticinterference. The plurality of pin-fins can be configured to attenuateradiation emitted from the front side of the module.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are not intended to be drawn to scale. Likereference numbers and designations in the various drawings indicate likeelements. For purposes of clarity, not every component may be labeled inevery drawing. In the drawings:

FIG. 1A is an exploded perspective diagram of an example OSFP moduleaccording to aspects of the disclosure.

FIGS. 1B-1C are different perspective views of the assembled OSFP moduleof FIG. 1A;

FIG. 1D illustrates a view of a front view of an example OSFP modulewith a heatsink having fins.

FIG. 2A is a top-down view of an OSFP module with example cooling holesand channels according to aspects of the disclosure.

FIGS. 2B-2D are top-down view illustrations of example cooling pin-finarrangements in an OSFP according to aspects of the disclosure.

FIG. 3A illustrates a cross-sectional view of an example OSFP module, ahousing, pin-fins, and air-foils according to aspects of the disclosure.

FIG. 3B illustrates a perspective view of an example OSFP module housingwith air-foils according to aspects of the disclosure.

FIG. 3C illustrates a cross-sectional side view of an example OSFPcooling system with optimized airflow according to aspects of thedisclosure.

FIGS. 4A-4C are side views of example OSFP modules with optimized heatflow through configuration of heatsinks and position of an ASIC relativeto a laser according to aspects of the disclosure.

FIGS. 5A-5D are views of example OSFP modules with heat dissipationimprovements through water cooling techniques using closed loop watercooling according to aspects of the disclosure.

FIGS. 6A-6C are side views of example OSFP modules with improvements toheat dissipation made based on heat paths through the use of flat heatpipes according to aspects of this disclosure.

FIG. 7 is a side view of example OSFP module and improvements to heatdissipation through the use of a bend-around heat pipe according toaspects of the disclosure.

FIGS. 8A-8E are various views of an example OSFP module and improvementsmade to heat dissipation through the use of an external bottom heatsink, according to aspects of the disclosure.

FIG. 9 is a graph illustrating various power and thermal aspects ofexample OSFP modules at different configurations.

FIG. 10A illustrates a side view of an example OSFP module 1000 with oneor more of the aspects discussed with reference to FIGS. 1A-8E.

FIG. 10B illustrates example airpaths in a side view of an example OSFPmodule

DETAILED DESCRIPTION

This disclosure generally relates to methods, systems, and apparatusesfor thermal and electrical optimizations in Octal Small Form factorPluggable (OSFP) optical transceiver modules.

FIG. 1A illustrates an exploded view of OSFP modules and improvementsaccording to aspects of this disclosure. 110 illustrates a block orgroup of OSFP modules, such as modules 111-114. The block of OSFPmodules are configured such that they are compatible with a cage, suchas cage 120. Cage 120 is a 1×4 cage meaning that it can house 4 OSFPmodules arranged in one row. Cage 120 has four openings and each openingcan be configured to house a single OSFP module. Other configurations ofcages are possible. In some examples, a 1×1 cage can house a single OSFPmodule, while in other examples, other arbitrary M×N modules arepossible. An OSFP module can contain other components such as opticals,optical receivers, optical transceivers, lasers, and processors toenable the transmission of data. Modules 111-114 and cage 120 can bepart of or installed within a larger enclosure. For example, the largerenclosure can have electronics, fans, cooling, or other systems toenable operation of OSFP modules. Cage 120 can have a top surface 121, abottom surface 122, vertical walls separating OSFP modules, such asseparator 123, and a back side or back portion of the separator, rearedge 124.

Module 114 is for example an OSFP compliant transceiver module whichmeets the parameters of the OSFP form factor and/or OSFP specifications.Module 114 is also an OSFP transceiver module with a connector on oneside, connector 115, and a heatsink 117 on the top of the module. Insome examples, heatsink 117 can be the top surface of module 114. Aninlet can be formed above or near connector 115. Module 114 is intendedto be mounted within a rack or cage, as further discussed below withreference to FIGS. 1A-1D. Connectors 115 can make one end or be formedtowards one end of module 114. Module 114 can have a throughput acrossthe number of lanes. For example, the throughput of module 114 may be400 Gbps or 50G per lane across the 8 lanes. In other examples, a higherthroughput of module 114 may exist and corresponding be higher acrossthe lanes.

Module 114 may also be in communication with a computing device. Thecomputing device can be any type of computing device such as a server,cluster of servers, virtual machine, laptop, desktop, mobile device, orcustom-designed hardware device. The computing device may contain aprocessor, volatile memory, non-volatile memory, a user interface, adisplay, communication interface(s), and instructions.

Although not illustrated in FIG. 1A, modules 111-114 may containprocessors or application specific integrated circuits (ASIC). Theprocessor or ASIC of modules 111 may be configured to enable signals tobe transmitted through the module. Module 111 may be configured invarious modes to enable both high-speed signals, such as those describedin the electric specifications of IEEE802.3bs, IEEE802.3cd, or low-speedsignals, such as those using the I2C or 13C protocols, which can usedfor configuration and control of module 111 by a host. The encoding orspecific implementation of the signals may depend on the capability ofthe ASIC or processor within module 111. Similarly, although notillustrated in FIG. 1A, module 111 may contain a laser.

Connector 115 can support various types of communication interfaces. Insome examples, connector 115 can be a duplex LC connector, which is atype of fiber connector developed by Lucent Technologies. In someexamples, connector 115 can be a multi-fiber push on (MPO) type ofoptical connector. In other examples, connector 115 can be any known orcompatible communication interface capable of enabling transfer of data.

Heatsink 130 is also illustrated in FIG. 1A. Heatsink 130 can be made ofa base section, such as base 131, and various fins, such as fins132-134. The absolute dimensions of the fins and the position of thefins relative to one another is constrained by the size of cage 120, aswell as OSFP guidelines and restrictions. In addition, the shape,relative location or position, or absolute position of the fins areoptimized to enable better airflow which in turn, can enable the OSFP toremain operable despite the higher amount of heat generated due to thehigher wattage requirements associated with an increased throughput.Heatsink 130 can be mechanically attached to cage 120 or make contactwith modules 111-114 through the use of springs, screws, clips, or othermechanism to allow the heatsink to easily attach to cage 120 and form asecure connection. Although heatsink 130 is shown as one unit, heatsink130 can be formed or made in multiple configurations or parts.

Each module can have a plurality of openings or inlets which allow airto enter into the internal volume of the module. For example, FIG. 1Aillustrates an inlet 119 of module 114 and inlet 116 of module 111, aswell as a surface 117 overlying the inlet 119. Air entering the inletcan cool the module and exit from the back of the module, outlet 114-B.Surface 117 can also cool heat generated within the modules. Surface 117can couple with base 131 of the heatsink in order to create a thermalconnection and allow heat to further dissipate. In some examples,surface 117 can form part of a heatsink or a vapor chamber. Twoair-paths are thus formed for cooling the modules.

FIG. 1B illustrates a view of assembled OSFP modules and improvementsaccording to aspects of this disclosure. As illustrated in FIG. 1B, base131 may be directly adjacent and contact heatsink 130 to allow heatgenerated within the module to dissipate and be conducted away from themodule. Fins 132-134 can divert heat away from the OSFP modules 111-114and allow cooling.

The fins can extend longitudinally across the length of cage 120parallel to the top surface 121, perpendicular to the top surface 121,or longitudinally across or parallel bottom surface 122 of cage 120between an edge of the cage adjacent separators 123 and an opposite andrear edge 124 of the cage. In the example shown in FIG. 1A, fins 132-134extend along a majority of a length of the cage. Any number of fins maybe provided across a width of cage 120. In the example shown, 36 finsextend across the width of the cage, but the number of fins can varywidely.

In some examples, fins may have a length ranging up to the length ofcage 120, such as 71.0 mm, a height of 9.9 mm, and a thickness of 0.5mm. In other examples, the height may range between 9.9 mm and 24.0 mm,the length may range between 6.5 mm and 71.0 mm, and the thickness mayrange between 0.4 mm and 0.7 mm. Fin pitch may range between 1.3 mm and4.0 mm. But in other examples, fins may have length less than 6.5 mm orgreater than 71.0 mm.

The relationship between air velocity and air pressure drop is roughlyquadratic. The power required to move air is roughly a cubic function ofthe air velocity. The relationship between the fins, the length of thefins, thickness, and contact points with heatsink 131 are optimized tomaximize cooling while ensuring that a pressure drop from the front ofthe OSFP compliant modules is not excessive.

FIG. 1C illustrates an additional view of assembled OSFP modules andimprovements according to aspects of this disclosure. Visible in FIG. 1Care outlets for the various modules, such as outlet 114-B. Outlets allowairflow to move from one end of the modules to the other. The airflowthrough the modules can additionally assist in cooling the modules inconjunction with the heatsinks and fins.

In some examples, one or more components illustrated with reference toFIGS. 1A-1C, can be partially or fully made from diamond composites,such as silver-diamond, aluminum-diamond, or copper-diamond. In someexamples, the diamond-composite material can consist of a surface layerwhich is pure metal surrounding an internal layer or internal core madeof diamond or diamond-metal hybrid. The surface layer which has a higherconductivity will allow heat to be transferred more quickly while theinternal core, which is made from diamond or diamond-composite, will notconduct heat in the same manner. Through selective use or engineering ofmaterials, heat can be directed away from areas of the module which aremore likely to overheat, such as the laser or the ASIC. For example, thecoefficient of thermal expansion for silver diamond is 6.5 ppm/K whilethe thermal conductivity is 900 W/(m.K). The low coefficient of thermalexpansion while retaining a high thermal conductivity allows for themodule to be more effectively cooled while retaining tight tolerances tomaximize the dimensions of the fins and other cooling components. Insome examples, the components can be made from any metal matrixcomposite material. A metal matrix composite material is a material withat least one of the materials being metal to allow for higher thermalconductivity while retaining properties of the other material.

FIG. 1D illustrates a view of a side view of a module 150 with aheatsink 160 and fins 160-171. The spacing of the fins illustrates avarying gap between fins 160-171 designed to optimize airflow andcooling over components or areas of module 150. For example, the gapbetween fin 165 and fin 166, and fin 166 and 167 is larger, allowing fora greater volume of air to flow closer to the center of module 150.Inlets 151-152 of module 150 allow air to enter into the interior volumeof module 150. Heatsink 160 can make thermal contact with module 150through base 160-C. As can be seen from the side view, two paths for airexist, allowing for additional cooling while keeping compliance with theOSFP specification.

While FIGS. 1A-1D provide several example arrangements of cooling fins,it should be understood that further arrangements are possible. Forexample, the number, spacing, shape, or combination of fins may bemodified. Additionally, although not illustrated in FIGS. 1A-D, anexternal housing can house cage 120. An opening with an external housingcan be optimized in terms of spacing, size, dimension, or geometry tooptimize for a physical parameter of the system such as for example,heat dissipation, pressure drop, or average temperature drop. As thereis usually a fixed volume, rate of airflow, or mass-flow rate across theopening of an external housing and through the external housing, theairflow can be divided across the inside of module 150 and acrossheatsink 160. As the total mass-flow rate is typically fixed, thedivision between the external housing and the internal housing can bedetermined by the opening of the external housing.

FIGS. 2A-2D illustrate top-down views of a portion of a module.Illustrated in FIG. 2A-2D are module components 210-240. Due to thelength of a module, such as module 111, there will be a pressure dropfrom one end to the other of the module and airflow may also berestricted within the module. Components 210-240 are designed to reduceexcessive pressure drop along the length of each component and allow forthe airflow to be less restricted. The module components can have a topsurface, such as surface 211, 221, 231, and 241.

Illustrated in FIG. 2A is component 210 with surface 211. Holes can beformed on surface 211, such as holes 212 and 213. Holes 212 and 213 arecircular in shape. Formed on surface 211 are a plurality of ridges,including ridge 215 and ridge 216, which can minimize the volumeoccupied by air as it moves over surface 211 of component 210.Additionally, the ridges help channel air in one direction or create“tunnels” of air. Ridge 215 and ridge 216 can extend longitudinallyalong the length of the module and the space between two adjacent ridgescan form “channels” which also extend along the length of the modules.The ridges can be thermally conductive and act as a heatsink or formpart of a heat transfer path away from module 210. This can assist inminimizing the pressure difference between the two ends of the surface.Although not illustrated, additional holes can be formed along thelength of surface 211 to further allow additional inlet air into theinterior volume of component 210. The holes can be of any shape or beshaped based on the exact form or dimensions of component 210 tomaximize the airflow inside the component. In some examples, the holescan be 2-5 mm in length and spaced at 5-10 mm. In other examples, holessmaller than 2 mm and larger than 5 mm and at any spacing can be formed.In other examples, the holes can be made in a zig-zag pattern. The holescan be made in a variety of patterns on surface 211.

Illustrated in FIG. 2B is component 220. Present on surface 221 are aplurality of pin-fins extending perpendicular to the length of surface221, such as pin-fin 222. These pin-fins minimize the air pressure dropfrom the one end of component 310 to the other end of component 310. Inaddition, pin-fins 222 can be shaped to further have an inlet or airfoils, which allow air to enter into the interior volume of thecomponent. The height of any one pin-fin is fixed by the OSFP formfactor, but the width and the length of the pin-fin can be optimized forthe smallest drop of pressure in air flow.

Pin fins may take on a variety of geometric shapes. In one example, asshown in FIG. 2B, pin-fins have an elongated and diamond shaped bodywith rounded edges. A width 228 at a central portion of pin-fin 222 canbe greater than a width 229 at the outermost and opposed ends of pin-fin222. In other examples, the pin-fins have a different shape, such asrounded, square, tear-drop, sinusoidal, or any variety or combinationsof shapes. The top surface 227 of pin-fin 223 may be planar, but inother examples, the top surface of pin-fin 222 may be non-planar andhave a curved surface. In some examples the top-surface of the pin-fincan be planar while in other examples the top surface of the pin-fin canbe contoured.

The pin-fins may be positioned on any portion of surface 221. In theexample of FIG. 2B, pin-fins 222 are positioned within a front half ofsurface 221 adjacent front edge 221-F of component 220. Pin-fins mayinstead be positioned within a rear half of surface 221 adjacent rearedge of component 220. In still other examples, pin-fins 222 may extendalong an entire length L or a majority of length L of surface 221. A fewof these additional examples will be further discussed below.

Pin-fins may be arranged in any number of patterns. As shown, rows ofpins are staggered along length L, such that a second row 226 of finpins is positioned between each of the fin pins in a first row 225. Thispattern can continue along the length L of surface 221. In otherexamples, pin-fins may be arranged in straight lines or columns.Similarly, pin-fins may be arranged at any random points along surface221.

Illustrated in FIG. 2C is component 230. Similar to component 220,present on surface 231 of component 230 are pin-fins 232 and 233. Thisexample illustrates pin fins extending along a majority of a length L ofsurface 231, and covering substantially the entire surface 231. In someexamples, the pin-fins can extend away from the surface, such as 2 mmaway from the surface. In other examples, the pin-fins can extend lessthan 2 mm or greater than 2 mm away from the surface.

The pin-fins may be formed in any geometric shape. In some examples, thepin-fins can formed of a fixed or varying height. The pins-fins may takeon a variety of shapes and the geometries of the pins may vary frompin-to-pin or row to row. In yet other examples, a variety of geometriescan be used for the pin-fins to create various pathways for airflow oversurface 241. In some examples, the geometry of the pin fin may be chosenbased on the known throughputs or thermal characteristics of an OFSPmodule. In other examples the geometry of the pin fin and arrangement ofthe pin-fins can be chosen based on the thermal characteristic of amodule, such as an ASIC or laser contained within it. In some examples,the plurality of pin-fins and foils can be arranged to form a partialarray on the surface of a component, as well as arranged to correspondto the location of a heat source within the component to enable thelowest pressure drop. For example, the pin fins may only cover a centralone-fourth portion of a surface in a relatively dense pattern whileother portions of the surface may not contain pin-fins or may containpin-fins of relatively lower density. In other examples, more complexgeometries, such as a Fibonacci spiral, can be arranged to optimize heatexchange, cooling, airflow, pressure, or other parameters. In someexamples, the pin-fins can form an array near an ASIC or laser withinthe module to allow for additional cooling in that region and improveoverall heat dissipation characteristics. The pin-fins can furtherprovide additional thermal connectivity with the cage in which the OSFPmodule is placed.

Illustrated in FIG. 2D is component 240. Similar to component 220,present on surface 241 of component 240 are pin-fins 242 and 243.Pin-fins 242 and 243 have different dimensions.

While FIGS. 2A-2D provide several example arrangements pin-fins, itshould be understood that further arrangements are possible. Forexample, the number, spacing, shape, or combination of pin-fins may bemodified. In some examples, an external heat sink, such as thatreferenced in FIGS. 1A-1D can be modified to mechanically mate orotherwise make contact with an arrangement of pin-fins to allow foradditional thermal dissipation.

FIG. 3A illustrates a cross sectional view of a housing 350 of an OFSPmodule fitted within a cage 360. Airflow is directed “into” the page orin the direction of arrows 365-368 shown in FIG. 3B. Housing 350 canhave a surface 351, and upon it a plurality of pin-fins, such as pin-fin352. Pin-fin 352 can further contain or form an air foil. An air-foilcan be created from the volume enclosed by a surface of a pin-fin. Thepin-fin can be shaped such that an interior portion of the pin-fin ishollow and forms an interior cavity. The interior cavity can provide aspace for air to enter into and fill the volume of the interior cavity.The interior cavity can take on a variety of shapes and in one examplemay possess a funnel-like shape, which is visible when viewed from thetop. In other examples, the outer surface of the pin-fin can includebreaks or openings in the surface to allow air to flow into the innervolume of the air-foil. For example, a portion of surface 241 enclosedby pin-fin 242 can be removed, creating a pathway for air to move acrossthe surface. This can further enhance cooling from the interior ofhousing 350 and maximize airflow into the air foil.

Cage 360 can be chamfered to contain depressions within the surface ofthe cage, such as at chamfer 361 and chamfer 362. Chamfers 361 and 362can be spring loaded such that they are flush with the internal surfaceof cage 360 unless an external force is applied to them. Uponapplication of an external force, chamfers 361-362 can be depressed intowards cage 360 in the same direction of the application of force. Thepin-fins can align within the depression of the chamfers. For example,chamfer 362 aligns with pin-fin 352. Thus, when inserting the housing350, or a module, such as module 231, into a cage, mechanical stressesand damage can be minimized by aligning the chamfers and pin foils. Inaddition, the pin foil can push against chamfer 362, depressing a springof chamfer 362, and make a tight connection with the chamfer 362. Inthis manner, any microcurrent or induced current within the system canbe effectively grounded through the mechanical and electrical contactbetween pin-foil 352 and chamfer 362.

Radiated emission or radio frequency energy can be emitted from thehousing in the opposite direction of the airflow. Radiation can begenerated during operation of the modules, such as by an ASIC or laserwithin the module. In some examples, pin-fins can be utilized andoptimized based on width, length, and to minimize pressure drop throughthe length of the housing while still attenuating radiated emissionssources. In other examples, the use of pin-fins arranged in rows offsetfrom one another attenuates the radiation as each pin-fin reflects backor attenuates radiation. In some examples, by using multiple rows ofpin-fins, the radiation can be attenuated by a larger extent. A personof skill in the art would understand that various combinations anddesigns are possible for various use cases of module 350.

FIG. 3B illustrates a partial view of a module, module 360. Module 360can be similar to module 111 described above. Illustrated in FIG. 3C isthe connecting side of module 360 with a receiver 362. Receiver 362 canbe any suitable receiver supported by the OSFP specification discussedabove. The module can also contain inlets above the receiver, which aredesigned to optimize airflow into module 360, such as inlet 369. Thespecific shape and design of the inlets can be based on the geometry ofmodule 360 as well as the operating conditions of electrical housingcontained within module 360. Illustrated in parallel arrows labeled 366and 377 is the direction of airflow into module 360. Additional arrowsare not illustrated for clarity in FIG. 3C, but it is understood thatair is flowing into the module 360 at many locations of inlet 369.

In some examples, the inlets, such as inlet 369, can be replaced with avapor chamber. A vapor chamber is a chamber which is filled with acoolant. The coolant, when heated, changes from a liquid phase to a gasphase. Once gaseous, the coolant circulates via convection and movesfreely through the chamber. The gaseous molecules condense on coldsurfaces, dissipate their heat load, and are channeled back to thecoolant reservoir. This process allows for cooling with a fixed or knownamount of coolant. The coolant reservoir can extend along part or theentire length of module 360.

FIG. 3C illustrates a side view of an OSFP module within a cage 370.Illustrated in FIG. 3C is a module 371 with a connector 372, and airduct 373, and a blower 374. Air entering module 371 is indicated with asolid line 376. Airflow between the connector 372 and air duct 373 thatis distributed to the blower 374 is indicated with a solid line 377. Airleaving the blower 374 in indicated with a solid line 378. Thetemperature of the air increases as it moves through the OSFP modulefrom the left side, adjacent a data connector of the module within cage370, through the right side of the cage 370. The temperature of the aircan reduce or stay similar as it moves out through cage 370 and left toright through membrane 373, and through to the right side, adjacent theblower 374. Module 371 can be similar to the modules described above,such as module 111. Air duct 373 can have a first end and a second end,and can enclose a fixed volume. Air duct 373 can be made of any suitablematerial, such as plastic, polymer, or metal. Air duct 373 be a ductwhich allows for air to be ducted away from one end of module 371.Blower 374 can be attached to one end of air duct 373 while module 371is attached to the other end. This attachment can create an airpath 375.As there is an independent pathway for the module, the airflow within amodule can be decoupled from the airflow of a tray or housing withinwhich the module is placed, a high pressure pathway can be created forthe module and be decoupled from the air-flow requirements of the trayor housing.

Further, the connections between module 371, air duct 373, and blower374 can be formed of a rigid, flexible, or semi-flexible membrane.Membranes and openings between the parts can be chosen on the basis ofthe geometry of the module, the air pressure, and the specific fluiddynamics generated by the system. For example, it is possible thatvortices or other undesirable phenomena are created by choosing thedimensions of the openings or connections between the module, air duct,and blower. Such vortices can disrupt the smooth airflow desired overmodule 371. In addition, vibrational load, frequency, resonancefrequency, temperature and other parameters must be considered whenengineering airpath 375 to ensure that the airpath can optimally coolthe OSFP module. In some examples, air duct 373 can be several cm longand form an angle relative to the module. The angle may range, forexample, between 5-35 degrees, but in other examples, the angle may beless than 5 degrees or greater than 35 degrees. The relative geometry ofthe air duct can be based on physical or operational parameters of themodule, such as the module length, the air pressure at any part withinthe module, the airflow through the module, or the temperature of theair exiting the module.

Blower 374 can be any device which can generate an air jet. The blowerwill create negative pressure, further increasing air flow throughmodule 371. This in turn will allow the module to be more effectivelycooled. In some examples, blower 374 can operate at a frequency of100-1000 rotations per minute and move 5 cubic-feet of air per minute.But, in other examples, the frequency may be less than 100 rotations perminute or more than 1000 rotations per minute to move 5 cubic feet ofair per minute. In still other examples, the rotations per minute can bemodified to move less than or more than 5 cubic-feet per minute. Theblower can be chosen to optimize cooling, airflow, pressure, ortemperature drop within the module. The blower can be chosen based onits frequency, vibrational characteristics, ability to create pressuregradients, or other similar parameters.

In some examples, the methods and apparatuses described with referenceto FIGS. 3A-3D can be used separately or in conjunction with oneanother.

FIG. 4A illustrates a schematic cross-sectional view of an OSFP module,module 400. FIG. 4A illustrates an ASIC 411, a laser 412, a printedcircuit board 413, and a housing of the OSFP module, housing 414, athermal path 415, and a heatsink 416. Also illustrated in FIG. 4A in adashed solid line is an expected path or one path for heat dissipation.The ASIC is an application specific integrated circuit. ASIC 411 ismounted to the bottom of the module. In some examples, laser 412 can bea laser operating at 10 watts. Laser 412 typically has an upperoperational temperature limit of around 70 C. However, ASIC 411 can runat much higher temperatures, and as illustrated in FIG. 4A, sits belowthe laser. During normal operation of the ASIC, the excess heatgenerated may disturb the normal operation of the laser, particularlygiven that the ASIC is further away from heatsink 416. The indirectthermal path not only causes heat to tend to move towards laser 412 butadditionally is ineffective in channeling heat away from the ASIC.

FIG. 4B illustrates a cross-sectional view of an OSFP module 450. Alsoillustrated in dashed solid lines are paths of heat dissipation frommodule 450. Similar to module 400, module 450 contains an ASIC 451, alaser 452, a printed circuit board 453, a housing of the OSFP module,housing 454, a thermal path 455, and a heatsink 456. By moving ASIC 451above printed circuit board 453 and moving laser 452 below the printedcircuit board, heat is more easily dissipated away from the hotter ASIC.In addition, printed circuit board 453 can act as an insulator andprevent some of the heat generated by ASIC 451 from reaching laser 452.

FIG. 4C illustrates a schematic cross-sectional view of an OSFP module460. FIG. 4A illustrates an ASIC 461, a laser 462, a printed circuitboard 463, and a housing of the OSFP module, housing 464, a thermal path465, and a heatsink 466. Also illustrates is an additional finned airheatsink, heatsink 470. Heatsink 470 sits below the OSFP module 400 andmakes contact with the module along a portion of the length of themodule. This enables the OSFP module to fit within cages withoutheatsink 470 obstructing the insertion of the module 400. Heatsink 470can also contain heatpipes, such as heatpipe 471. Heatpipe 471 can bemade of any conductive material, such as a metal or metal compound. Insome examples, the heatpipe can be made of copper, gold-composites,silver, or other metal composite materials. The material of heatpipe 471can be chosen based on a coefficient of thermal expansion of both theheatsink material and the heatpipe. By adding heatsink 470, it ispossible to more efficiently cool ASIC 461 and allow more heat to bedissipated via heatsink 460 as compared to heat sink 461. In someexamples, the surface area of heatsink 470 can be increased through theuse of fractal geometry. In some examples, the amount of heat dissipatedby heatsink 470 can be between 10-100 watts. Although heatsink 470 isoriented in one direction, it is understood that the heatsink can beoriented at various directions relative to module 460. The airflow canalso be oriented in various directions relative to module 460 andheatsink 470.

In some examples, heatpipes can be replaced with vapor chamberscontaining coolant to provide additional cooling. A coolant can bechosen to be a material with a high thermal conductivity, a materialwith phase changes, or a material with a high specific heat.

FIG. 5A illustrates a top-down view of a rack which can house severalOSFP modules, rack 500. Rack 500 has a front side and a back side. Rack500 is designed to house and cool OSFP modules when inserted into thefront side. Rack 500 can house cages, such as cage 120. Rack 500 has aplurality of heat exchangers which correspond to OSFP modules. Forexample, heat exchanger 501 corresponds to four OSFP modules. Heatexchanger 502 corresponds to a single OSFP module. The heat exchangerscan contain a suitable liquid coolant which can absorb heat generatedfrom an OSFP. The liquid coolant will be directed towards a network ofpipes, which will direct heat towards the rear of rack 500. At the rearof rack 500 heat carried by the coolant away from the OSFP modules canbe removed from the coolant through a liquid to air heat exchanger, suchas intercooler 510. Intercooler 510 can be made of a material with ahigh amount of thermal conductivity and be designed with a large surfacearea to remove the highest amount of heat possible from the intercooler.Additionally, to help maintain airflow through the rack 500, fans can beincluded at the back side of rack 500.

FIG. 5B illustrates a top-down view of a rack which can house severalOSFP modules. Rack 530 can be similar to rack 500. Rack 530 has aplurality of heat exchangers which correspond to OSFP modules. Forexample, heat exchanger 530 corresponds to four OSFP modules. Heatexchanger 532 corresponds to a single OSFP module. The heat exchangerscan contain a suitable liquid coolant which can absorb heat generatedfrom an OSFP. The liquid coolant will be directed towards a network ofpipes, which will extend through the front of the rack and be connectedwith an external coolant distribution unit (CDU), such as CDU 540. CDU540 can be chosen based on size and thermal requirements of the OSFPsystem or rack. For example, CDU systems which provide upwards of 200 kWof cooling in less than 1 m² of space can be chosen for certain OSFPapplications where a greater amount of heat is likely to be generated.

FIGS. 5C and 5D illustrate a top-down view and a side view of an OSFPmodule 550 with direct water cooling. Module 550, similar to the modulesdescribed above, has a front side which can receive a connector and aback side. The module also has a top surface, surface 551. The modulecan also contain a cold plate, such as cold plate 560. The cold platecan be a reservoir capable of holding liquid. In other examples, coldplate 560 can be a network of pipes of a single pipe running the lengthof module 550 several times or looped within module 550. In someexamples, the cold plate can be collected around a hot spot on module550. The back side of module 550 can contain an input for cooler water,input port 561 and an output for warm water, output port 562 returningfrom the cold plate 560. Input port 561 can be in fluid communicationwith cold plate 560, which can in turn be in fluid communication withoutput port 562. Collectively, this forms a closed loop which can beexternally cooled before returning to the interior of module 550. Theaddition of input port 561 and output port 562 still allows the OSFPform factor to be retained and ensures compatibility with existing OSFPracks. Input port 561 and output 562 can be made of thermally conductivematerial with low coefficients of thermal expansion and can beapproximately between 1 mm and 5 cm. In addition, the ports can becapable of supporting any suitable flow and pressure depending oncooling requirements.

FIG. 6A illustrates a schematic cross-sectional view of an OSFP module600. Module 600 can be similar to module 400 and its components. FIG. 6Aillustrates an ASIC 611, a laser 612, a printed circuit board 613, and ahousing of the OSFP module, housing 614, a thermal path 615, and aheatsink 616. The ASIC is an application specific integrated circuit.ASIC 611 is mounted to the bottom of the module. Additionally, OSFPmodule 600 can contain flat heat pipes which are integrated towards thebottom of the module 600, such as heatpipes 618 and 619. These flat heatpipes can be made of a highly conductive material. Keeping the heatpipes relatively flat can allow the OSFP module specifications to bemaintained.

FIG. 6B illustrates a schematic cross-sectional view of an OSFP module650. Module 650 can be similar to module 400 and its components. FIG. 6Billustrates an ASIC 611, a laser 662, a printed circuit board 663, and ahousing of the OSFP module, housing 664, a thermal path 665, and aheatsink 669. The ASIC is an application specific integrated circuit.ASIC 661 is mounted to the bottom of the module. Additionally, OSFPmodule 600 can contain flat heat pipes which are integrated towards thebottom of the module 600, such as heatpipes 668. These flat heat pipescan be made of a highly conductive material. Keeping the heat pipesrelatively flat will allow the OSFP module specifications to bemaintained while still allowing for improved cooling. In addition,cooling fins can be added to the bottom of the module to provideadditional cooling. In some examples, housing 664 can be indented orotherwise modified to allow space for additional cooling fins to beincorporated without affecting the dimensions of module 650 orpreventing it from being integrated within a rack.

FIG. 6C is another side view of an OSFP module 650 with similar featuresas described with reference to FIG. 6B.

FIG. 7 illustrates a schematic cross-sectional view of an OSFP module700. Module 700 can be similar to module 400 and its components. FIG. 7illustrates an ASIC 711, a laser 712, a printed circuit board 713, and ahousing of the OSFP module, housing 714, a thermal path 715, and fins716. Fins 716 can also be a heatsink. The ASIC is an applicationspecific integrated circuit. ASIC 711 is mounted to the bottom of themodule. Additionally, OSFP module 700 can contain flat heat pipes whichare integrated towards the bottom of the module 700, such as heatpipes718. These flat heat pipes can be made of a highly conductive material.Keeping the heat pipes relatively flat will allow the OSFP modulespecifications to be maintained. In some examples, heatpipe 718 can be avapor chamber.

FIGS. 8A-8E illustrate various views of an OSFP module 800.

FIG. 8A illustrates an exploded view of an OSFP compatible module 800.Illustrates is an internal cooling component 810 with a surface 811 andinlets 812. A first middle component 820 contains a heat spreader 821.Heat spreader 821 can be a heat sink, heat pipe, or heat spreader. Heatspreader 821 can be a vapor chamber with an evaporator and condenser.Heat spreader 821 can be made of material with high thermal conductivityor can be made of a material with much higher thermal conductivity ascompared to other materials of module 800. For example, heat spreader821 can be made of a metal or metal compound. Heat spreader 821 can bein thermal contact with cooling component 810. In some examples, heatspreader 821 and cooling component 810 can be one continuous component.In these examples, additional thermal cooling can be realized as thenumber of thermal interfaces is reduced. Heat spreader 821 can be asthick as a portion of middle component 820 and make thermal contact witha heat source. One side of heat spreader 821 can make thermal contactwith cooling component 810 while the opposite side of heat spreader 821can make contact with a heat source. Second middle component 830 cancontain a front side with a data connector 831. In some examples, dataconnector 831 can contain a layer of a material with low thermalconductivity to prevent a heat source in contact with heat spreader 821from transmitting or conducting heat towards the bottom of module 800.Middle component 830 can be configured to house electronics, which aresources of heat, such as a laser or an ASIC. Bottom component 840 cancontain a heat spreader 841. Heat spreader 841 can be a heatsink or athermally conductive surface in thermal contact with a heat source, suchas electronics, an ASIC, or a laser. In some examples, heat spreader 841can extend beyond the bottom surface of module 800 and into a largersystem. In some examples, heat spreader 841 can form an externalheatsink. In some examples, heat spreader 841 can be a vapor chamber. Insome examples, heat spreader 841 can contact an external heatsink orcooling component. Heat spreader 821, heat spreader 841, thin vaporchambers, or flat heat pipes can be bonded to the top or bottom ofmodule 800 to improve heat dissipation. In some examples, the exteriorcontact surface of heat spreader 821 and heat spreader 841, which can bevapor chambers or heat pipes, can be flush to or slightly sub-flush tothe exterior surfaces of the module 800.

FIG. 8B illustrates a top-down view of assembled OSFP compatible module800 with surface 811, inlets 812, heat spreader 821, heat spreader 841.Also illustrated in FIG. 8B is a printed circuit board 832. The printedcircuit board can interface with electronics inside and external tomodule 800. In addition, the printed circuit board can be made ofmaterials with low thermal conductivity. In some examples, a laser canbe installed in the upper portion of module 800 and be in thermalcontact with heat spreader 821 while an ASIC is installed in the lowerportion, under the printed circuit board 832, and in thermal contactwith heat spreader 841. The laser would be able to dissipate heatthrough the heat spreader 821 while the ASIC through heat spreader 841.The overall cooling through the module is thus increased in this manner.

FIG. 8C illustrates a bottom-up view of assembled OSFP compatible module800 with heat spreader 841 and data connector 831 visible. In someexamples, a cut-out can be made in module 800 to allow heat spreader 841to contact an external heatsink. In other examples, heat spreader 841can form part of the external surface of module 800 or otherwise beflush with the surface. In some examples, heat spreader 841 can be incontact with an external cooler. In some examples, the external cooleror heatsink can be a liquid heat exchanger, a peltier heat pump, or anadditional heat pipe.

FIG. 8D illustrates module 800 within a cage 860. Cage 860 can bemounted to a printed circuit board 851. Cage 860 can contain severalopenings, such as opening 861 and 862 to house modules, such as module800. Printed circuit board 851 can be installed within a largerenclosure. Printed circuit board 851 can interface with electronicswithin one or more modules. Cage 860 and printed circuit board 851 canbe configured to allow a heatsink, heatsink 852, to make thermal contactwith module 800 through heat spreader 841 as discussed earlier. Forexample, the printed circuit board and cage can have cutouts matchingthe external heat sink. In some examples, cage 860 can be spring loadedto allow for easier compatibility with mechanical matching ofcomponents. In other examples, cage 860 can be springless.

FIG. 8E illustrates a schematic cross-sectional view of module 800, anexternal heat sink 852, and printed circuit board 851. In addition tothe various components discussed with reference to FIGS. 8A-8D, FIG. 8Eillustrates a laser 890 and an ASIC 891.

FIG. 9 illustrates thermal and electrical aspects of an example OSFPcompliant transceiver module at various operational temperatures. Thehorizontal axis of the graph 900, axis 905 indicates the throughput ofan OSFP module. The vertical axis of graph 900, axis 910, indicates thethermal performance required for a certain throughput. Three data pointsare plotted, data points 921-923, corresponding to throughputs of 400Gbps, 800 Gbps, and 1.6 Tbps respectively. For example, it is expectedthat an 800G bitrate will require 19 W of power while a 1.6T bitratewill require 25 W of power. These latter bitrates cannot be supportedwith the current OSFP form factor as too much heat is generated for theOSFP module to operate properly. At higher temperatures, the airpressure drop inside the module can be too high to effectively cool themodule in ambient and static conditions.

FIG. 10A illustrates a side view of an OSFP module 1000 with one or moreof the configurations discussed above with reference to FIGS. 1A-8E.FIG. 10 illustrates an external housing 1010 which can have an inlet1050. Module 1000 has a front side with an inlet 1040, a back side witha backside or air outlet, outlet 1080, and a top surface 1030 formedbetween the front side and the back side. Module 1000 can have anexternal heat sink 1020 attached to the top surface 1030. Module 1000can also have an internal surface 1041, which as explained above, can insome examples contain holes to allow air to vent into an interiorportion of module 1000. Module 1000 can have a surface 1060. In someexamples, surface 1060 can be configured to allow an external bottomheatsink to be in contact with surface 1060. Housing 1010 can have abottom portion, portion 1070. In some examples, portion 1070 can be cutto create an opening for a bottom heatsink.

FIG. 10B illustrates airpaths in a side view of OSFP module with one ormore of the configurations discussed above with reference to FIGS.1A-8E, airpaths 1081-1085. Airpath 1085 can enter through inlet 1050 ofhousing 1010 and flow above OSFP module 1000. Airpath 1081 can enterthrough inlet 1050 of housing 1010 and flow through an external heatsink 1020 which is thermally connected to top surface 1030 of module1000. Airpath 1082 can enter through inlet 1040, move through the lengthof the OSFP module 1000, and leave through air outlet 1080. As discussedabove, airpath 1082 can encounter pin-foils, such as pin-foil 222.Airpath 1083 can enter through holes within the internal surface, suchas hole 212, and move through an internal portion of module 1000 beforeexiting through the back end. Airpath 1084 can run parallel to thebottom portion of module 1000. Airpath 1084 can cross an externalheatsink attached to the bottom of the module to provide additionalcooling.

While this disclosure contains many specific implementation details,these should not be construed as limitations on the scope of what may beclaimed, but rather as descriptions of features specific to particularimplementations. Certain features that are described in thisspecification in the context of separate implementations may also beimplemented in combination in a single implementation. Conversely,various features that are described in the context of a singleimplementation may also be implemented in multiple implementationsseparately or in any suitable sub-combination. Moreover, althoughfeatures may be described above as acting in certain combinations andeven initially claimed as such, one or more features from a claimedcombination may in some cases be excised from the combination, and theclaimed combination may be directed to a sub-combination or variation ofa sub-combination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous.

References to “or” may be construed as inclusive so that any termsdescribed using “or” may indicate any of a single, more than one, andall of the described terms. The labels “first,” “second,” “third,” andso forth are not necessarily meant to indicate an ordering and aregenerally used merely to distinguish between like or similar items orelements.

Aspects of the technology may include an assembly comprising:

an octal small form factor pluggable (OSFP) module comprising a dataconnector and inlet apertures configured enable airflow between aninterior portion and an exterior portion of the OSFP module;a first heatsink having a top surface and an opposed bottom surfacefacing toward the OSFP module; a first plurality of hollow channelsformed between the OSFP module and the bottom surface;a second heatsink having a surface overlying the top surface of thefirst heatsink and thermally connected with the top surface; and/ora plurality of fins extending away from the surface of the secondheatsink; and/or wherein a first space between at least a first pair oftwo adjacent fins of the plurality of fins differs from a second spacebetween a second pair of adjacent fins, so as to optimize a thermalperformance characteristic of the module; and/orwherein the second heatsink contacts the top surface; and/ora housing for receiving the OSFP module therein and positioned betweenthe second heatsink and the surface; and/orwherein the housing includes an opening through which the OSFP moduleand the second heatsink are thermally interconnected; and/orwherein at least part of the module is comprised of a diamond compositematerial; and/orwherein the diamond composite material is aluminum diamond; and/orwherein at least part of the module is made of a metal compositematerial; and/orcontaining an external or internal water cooling element; and/orcontaining a vapor chamber; and/orcontaining a bottom heat sink.

Aspects of the disclosed technology can include any combination of thefollowing features:

¶1. An assembly comprising:an octal small form factor pluggable (OSFP) module comprising a dataconnector and inlet apertures configured enable airflow between aninterior portion and an exterior portion of the OSFP module;a first heatsink having a top surface and an opposed bottom surfacefacing toward the OSFP module;a first plurality of hollow channels formed between the OSFP module andthe bottom surface;a second heatsink having a surface overlying the top surface of thefirst heatsink and thermally connected with the top surface; anda plurality of fins extending away from the surface of the secondheatsink.¶2. The assembly of ¶1, wherein a first space between at least a firstpair of two adjacent fins of the plurality of fins differs from a secondspace between a second pair of adjacent fins, so as to optimize athermal performance characteristic of the module.¶3. The assembly of ¶¶1-2, wherein the second heatsink contacts the topsurface.¶4. The assembly of ¶1-3, further comprising a housing for receiving theOSFP module therein and positioned between the second heatsink and thesurface.¶5. The assembly of ¶¶1-4, wherein the housing includes an openingthrough which the OSFP module and the second heatsink are thermallyinterconnected.¶6. The assembly of ¶¶1-4, wherein at least part of the module iscomprised of a diamond composite material.¶7. The assembly of ¶¶1-6, wherein the diamond composite material isaluminum diamond.8. The assembly of ¶¶1-6 wherein at least part of the module is made ofa metal composite material.¶9. A system comprising:

an outer housing having an opening; and

the assembly of ¶1 disposed within the outer housing, wherein theplurality of fins are configured to receive airflow from the opening.¶10. A system comprising:

-   -   an Octal Small Formfactor Pluggable (OSFP) module, the module        comprising:    -   a front side and a back side opposite the front side;        -   a substantially continuous top surface extending from a            portion of the front side to a portion of the back side;    -   a data connector formed on the front side;    -   an air duct with a first end and a second end, the first end of        the air duct forming a closed connection with the back side of        the module;    -   a blower, with a first end and an exhaust, the first end of the        blower forming a closed connection with the second end of the        air duct; and    -   an airpath formed from the front side of the module to the        exhaust end of the blower through at least the air duct.        ¶11. The system of ¶10 further comprising the air duct formed        from a metal composite material.        ¶12. The system of ¶¶10-12 wherein the relative dimensions of        the air duct based on an air-pressure or an air-speed at the        back side of the module.        ¶13. The system of ¶¶10-12 wherein the geometry of the air duct        is arranged to prevent the formation of vortices within the        system.        ¶14. The system of ¶¶10-13 wherein a frequency of the blower is        based on the geometry of the module.        ¶15. The system of ¶¶10-13 wherein a frequency of the blower is        based on the air-pressure or air-speed at the back side of the        module.        ¶16. The system of ¶¶10-15 wherein the airpath is optimized for        heat dissipation from the module and/or the system is connected        or thermally coupled to a water source and/or the module        contains a vapor chamber.        ¶17. An Octal Small Formfactor Pluggable (OSFP) module,        comprising:    -   a front side and a back side opposite the front side;        -   a substantially continuous top surface extending from a            portion of the front side to a portion of the back side;    -   a data connector disposed formed on the front side; and    -   a plurality of pin-fins formed in an array across the top        surface, each pin-fins substantially non-linear in shape and        enclosing an area formed by a closed loop on the top surface,        wherein the plurality of pin-fins minimize a pressure gradient        between the front side and the back side of the module.        ¶18. The module of ¶17 wherein each pin-fin is formed in a        diamond shape.        ¶19. The module of ¶¶17-18 wherein the front side contains        substantially open air channels above the data connector.        ¶20. The module of ¶¶17-19 wherein the plurality of pin-fins are        arranged in rows, the rows offset from one another.        ¶21. The module of ¶19 wherein the plurality of pin-fins cover        at least 30% of the surface area of the top surface.        ¶22. The module of ¶¶17-19 wherein each pin-fin forms an        air-foil, the air-foil providing a path for fluid to move across        the top surface.        ¶23. The module of ¶¶17-20 wherein the air-foil is configured to        align with a spring-loaded chamfer formed in a housing for the        module.        ¶24. The module of ¶23 wherein the plurality of pin-fins are        configured to attenuate electro-magnetic interference.        ¶25. The module of ¶23 wherein the plurality of pin-fins are        configured to attenuate radiation emitted from the front side of        the module.        ¶26. The module of ¶17 wherein the module is connected or        thermally coupled to a water source and/or a bottom heat sink        and/or a vapor chamber and/or an inlet and/or aperture and/or a        blower.

Various modifications to the implementations described in thisdisclosure may be readily apparent to those skilled in the art, and thegeneric principles defined herein may be applied to otherimplementations without departing from the spirit or scope of thisdisclosure. Thus, the claims are not intended to be limited to theimplementations shown herein, but are to be accorded the widest scopeconsistent with this disclosure, the principles and the novel featuresdisclosed herein.

1. An assembly comprising: an octal small form factor pluggable (OSFP)module comprising a data connector; a first heatsink having a topsurface and an opposed bottom surface facing toward the OSFP module; afirst plurality of hollow channels formed between the OSFP module andthe bottom surface; a second heatsink having a surface overlying the topsurface of the first heatsink and thermally connected with the topsurface; and a plurality of fins extending away from the surface of thesecond heatsink.